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Location	Date	Summary	Deadline
Europe	06-Dec-2025	Delivery Of The Wire Bonder Device.	12-Dec-2025
Africa	06-Dec-2025	Supply And Delivery Of Thin Film Evaporation System.	08-Dec-2025
Europe	05-Dec-2025	F2/183/2025/zp Delivery Of The Wire Bonder Device..	12-Dec-2025
Europe	05-Dec-2025	Silicon Austria Labs – Frame / Wafer Cleaning Unit.	18-Dec-2025
Europe	05-Dec-2025	Tno8 - Metal Backend Evaporation System.	22-Jan-2026
Europe, Mediterranean	05-Dec-2025	Usc-2026-0001: 035a-25 Supply Of A Magnetron-assisted Cathodic Sputtering Deposition Equipment For The Usc Ciqus.	08-Jan-2026
Europe, Mediterranean	05-Dec-2025	Usc-2026-0001: 035a-25 Supply Of Magnetron-assisted Sputtering Deposition Equipment For The Usc Ciqus.	08-Jan-2026
Asia, Asia Pacific, APEC Countries	05-Dec-2025	Greatech Substrates (wuxi) Co., Ltd.project-target Driller (rebid).	25-Dec-2025
Asia, Asia Pacific, APEC Countries	05-Dec-2025	Greatech Substrates (shenzhen) Co., Ltd. Project-acid Etching Machine (rebid).	25-Dec-2025
Asia, Asia Pacific, APEC Countries	05-Dec-2025	Nantong Shennan Circuits Co.,ltd. Project-double-layer Bonding Machine (rebid).	25-Dec-2025

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