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Location Date Summary Deadline
Asia, Asia Pacific, APEC Countries08-Nov-2026Wafer And Chip Bonding Equipment Set.
 21-Dec-2026
Asia, Asia Pacific, APEC Countries08-Nov-2026Superconducting Quantum Computer Chip Set.
 16-Dec-2026
Asia, Asia Pacific, APEC Countries08-Nov-2026Gas Cabinet For Ald Film Deposition Equipment Set.
 09-Dec-2026
Asia, Asia Pacific, APEC Countries08-Nov-2026Wafer Surface Plasma Activation Device Set.
 25-Nov-2026
Europe07-Nov-2026Comprehensive Service For Devices For Applying Coatings Using Spray Methods With Ultrasonic Nozzles And Through Physical Vapor Deposition – Nanopvd And For The Device (...).
 16-Nov-2026
Europe07-Nov-2026Announcement Of The Order For Comprehensive Service For Devices For Applying Coatings Using Ultrasonic Nozzles And Through Physical Vapor Deposition - Nanopvd And For The Device (...).
 16-Nov-2026
Europe07-Nov-2026Bzp: Delivery Of Consumable Materials For Coating Application Devices Using Ultrasonic Nozzles And Through Physical Vapor Deposition - Nanopvd And For The Device (...).
 13-Nov-2026
Americas, APEC Countries07-Nov-202649--hot Bonder-controll.
 13-Nov-2026
Europe, Mediterranean06-Nov-2026Supply Of Two Rotating Targets For Ms-pvd Equipment.
 27-Nov-2026
Europe06-Nov-2026Announcement Of The Order For The Delivery Of Consumable Materials For Coating Application Devices Using Ultrasonic Nozzles And Through Physical Vapor Deposition - Nanopvd And For The Device (...).
 13-Nov-2026
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