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» Electronic integrated circuits and microassemblies Tenders
210 - Document matches your request
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Location
Date
Summary
Deadline
Asia, Asia Pacific
25-May-2024
Design Of Card4, Manufacturing Of Card4.
Qty : 16
.
14-Jun-2024
Europe, CIS
25-May-2024
Services Of Communication Providers, Namely: Top-up Of An Iridium Sim Card.
01-Jun-2024
Americas, APEC Countries
25-May-2024
Rfp 5998-01-370-4203fx; Main Interconnect Assembly Circuit Card Assembly (cca) For The Wide Field Of View Heads Up Display (wfov Hud).
24-Jun-2024
Americas, APEC Countries
25-May-2024
59--circuit Card Assemb, In Repair/modification Of.
06-Jun-2024
Africa
25-May-2024
Acquisition Of Prepaid Cards Telephone.
30-May-2024
Africa
24-May-2024
Acquisition Of Prepaid Cards.
30-May-2024
Europe
24-May-2024
Joint Market Open Procedure For The Manufacture And Assembly Of Electronic Cards.
27-Jun-2024
Europe
24-May-2024
Module - Aib 1-02 Card 5295309312/78 Replaced X00e50209721/78 For Mtu16v4000 M70 To Sa132/134.
03-Jun-2024
Americas, APEC Countries
24-May-2024
59--microcircuit,digita.
03-Jun-2024
Americas, APEC Countries
24-May-2024
59--circuit Card Assemb, In Repair/modification Of.
27-Jun-2024
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