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Shanghai Xinyuan Innovation Center Semiconductor Outsourcing Wafer Procurement Project - Tender Announcement in CHINA
| TI Ref No: | 538060176 |
| Date : | 25 Sep 2026 |
| Description: | Shanghai Xinyuan Innovation Center Semiconductor Outsourcing Wafer Procurement Project - Tender Announcement, CHINA |
| Deadline: | 15 Oct 2026 |
| Document Type | Tender Notice |
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