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Polyimide Film Covered High Conductivity .#* Polyimide Film Covered High Conductivity Copper Conductor Annealed Bare size: 7.5 (+/-) 0.07 X 4.8 (+/-) 0.05 Mm, Overall Size After Heat Sealing With (1/2) Overlap (51 % To 55%): 7.65 X 4.95 Mm With Polyimide in INDIA
| TI Ref No: | 534418241 |
| Date : | 23 Jun 2026 |
| Description: | Polyimide Film Covered High Conductivity .#* Polyimide Film Covered High Conductivity Copper Conductor Annealed Bare size: 7.5 (+/-) 0.07 X 4.8 (+/-) 0.05 Mm, Overall Size After Heat Sealing With (1/2) Overlap (51 % To 55%): 7.65 X 4.95 Mm With Polyimide, INDIA |
| Deadline: | 08 Jul 2026 |
| Document Type | Tender Notice |
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