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The Project Involves The Supply And Installation Of Bondline Stress And Strain Sensors Along With A Data Acquisition Device And Software. The Work Includes Testing And Commissioning Of The Equipment, As Well As Training For Operators. Bondline Stress And in INDIA
| TI Ref No: | 532498097 |
| Date : | 08 May 2026 |
| Description: | The Project Involves The Supply And Installation Of Bondline Stress And Strain Sensors Along With A Data Acquisition Device And Software. The Work Includes Testing And Commissioning Of The Equipment, As Well As Training For Operators. Bondline Stress And, INDIA |
| Deadline: | 30 May 2026 |
| Document Type | Tender Notice |
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