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Nantong Kangyuan Integrated Circuit Packaging Substrate Project (phase I)- Automated Warehouse 1 Set in CHINA
| TI Ref No: | 530731251 |
| Date : | 23 Mar 2026 |
| Description: | Nantong Kangyuan Integrated Circuit Packaging Substrate Project (phase I)- Automated Warehouse 1 Set, CHINA |
| Deadline: | 14 Apr 2026 |
| Document Type | Tender Notice |
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