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Contract Awarded For Tcwm - Thermocompression Wafer Molding the Aim Of The Tender Was The Purchase Of A Thermocompression Form (thermal Compression Molding) For Sals Pilot Line For Fan-out-wafer-level-packaging (https://projekte.at/projekt/4798640) value in JAPAN
| TI Ref No: | 516399531 |
| Date : | 31 Mar 2025 |
| Description: | Contract Awarded For Tcwm - Thermocompression Wafer Molding the Aim Of The Tender Was The Purchase Of A Thermocompression Form (thermal Compression Molding) For Sals Pilot Line For Fan-out-wafer-level-packaging (https://projekte.at/projekt/4798640) value, JAPAN |
| Document Type | Contract Awards |
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